Fabrication of semiconductor device

Manufacture ofsemiconductor is the process by which chips are made. These chips are ICS that are present in appliances, and electrical and electronic devices. The process of manufacture of semiconductor is more steps, during which a wafer is created using pure material that leads seeds. Usually Silicon is used to make integrated circuits. However, gallium arsenide and germanium are also used.

The whole manufacturing process takes six to eight weeks. This includes packing of the chips.

A wafer is composed of pure silicon ingots. These ingots are sliced into wafers of thickness 0.75 mm. Then they are polished to achieve a flat surface and even. After this, many steps are required to make this into an integrated circuit wafers.

By the time the chips went smaller and smaller, which leads to their being produced in clean rooms. These s clean roomare called fabs. Fabs are pressurized with filtered air to remove even the smallest particle as might rest on wafer and make it bad. People who work in manufacturing plants are kept constantly wearing clean room to protect the chip from contamination.

With the increased demand semiconductors, are now being manufactured in a number of countries such as Ireland, Japan, Taiwan, Korea, Singapore, China and the United States. Intel is the leading producer in the world and has production plants in Europe, Asia and the United States. Other major semiconductormanufacturers are Samsung, Texas Instruments, Advanced Micro Devices, Toshiba, Semiconductor Taiwan Manufacturing Company, Sony Semiconductorand NXP.

According to us industry & Market Outlook, there are about semiconductor and 5,000 manufacturers of electronic components in the United States alone and contribute 165 billion dollars in terms of sales.

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