Semiconductors Device Fabrication

Semiconductor device fabrication is the process by which chips are made. These chip are integrated circuits that are present in electrical and electronic devices and appliances. The process of semiconductor device fabrication is of multiple steps during which a wafer is created using pure semi conducting material. Usually Silicon is used to make integrated circuits. However, Gallium arsenide and Germanium are also used.

The entire fabrication process takes six to eight weeks. This includes the packaging of the chips.

A wafer is made from pure silicon ingot. These ingot are sliced into 0.75 mm thick wafers. Then they are polished to get a flat and even surface. After this many steps are required to make this wafer into an integrated circuit.

With time the integrated circuits have gone smaller and smaller, leading to them being produced in clean rooms. These clean rooms are called fabs. Fabs are pressurized with filtered air to remove even the smallest particle as it might rest on the wafer and make it defective. People working in the manufacturing facilities are required to constantly wear clean room suits to protect the chips from contamination.

With the demand increasing, semiconductors are now being manufactured in a number of countries like Ireland, Japan, Taiwan, Korea, Singapore, China and the US. Intel is the world's leading manufacturer and has manufacturing facilities in Europe, Asia and the US. Other top manufacturers of semiconductors are Samsung, Texas Instruments, Advanced Micro Devices, Toshiba, Taiwan Semiconductor Manufacturing Company, Sony and NXP Semiconductors.

According to US Industry & Market Outlook, there are approximately 5,000 semiconductor and electronic component manufacturers in the United States alone and they contribute $165 billion in terms of sales.

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